
Supreme 10HTF Product Description
One Component, Heat Curing, Toughened Epoxy Adhesive/Sealant with High Peel and Shear Strength and Exceptionally Wide Temperature Range Featuring a Very Rapid "Snap Cure"
Master Bond Polymer System Supreme 10HTF is a one-part/no-mix system featuring a unique combination of properties including high shear and peel strength, exceptionally wide service temperature range and very rapid "snap cures". The recommended cure for optimum bond strength is 2 minutes at 375-400°F. A more typical cure is 5-10 minutes at 300°F with the minimum cure being 20-30 minutes at 230°F. Tensile shear strengths in excess of 3,000 psi and T-peel strengths in excess of 20 pli are readily obtained. Supreme 10HTF requires no mixing and maintains a consistent viscosity (i.e. it will not thicken) over extended time periods. Supreme 10HTF requires refrigeration and has a shelf life of 3 months at 40°F.
Supreme 10HTF forms high strength bonds serviceable over the remarkably wide temperature range of 4K to 400°F making it well suited for cryogenic applications. It is a toughened system, offering superior resistance to impact, vibration, stress fatigue cracking and thermal shock and cycling while maintaining the moisture, creep, corrosion and thermal resistance typical of epoxy resins. It is 100% reactive and does not contain any diluents or solvents.
Supreme 10HTF resists many chemicals including water, oil, fuels and most organic solvents even upon prolonged exposures. It adheres well to metals, glass, ceramics, wood, vulcanized rubbers and many plastics. The cured Supreme 10HTF is an outstanding electrical insulator. While its normal color is gray, other colors can be formulated. A non-drip version called Supreme 10HTFND-2 is also available. Master Bond Polymer System Supreme 10HTF's high performance coupled with its convenient handling make it well suited for applications in the aerospace, electronic, electrical, computer, metalworking, appliance, automotive and chemical industries. It is particularly recommended for microelectronic applications.
Explore more products...
- Epoxy |
- Heat Cure |
- Snap Cure |
- Chemically Resistant |
- Cryogenic |
- Non-Drip |
- Electrically Insulative |
- High Temperature Resistant |
- High Peel Strength |
- Thermal Cycling Resistant |
- High Shear Strength |

