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Snap Cure Adhesives
Cutting edge snap cure adhesives facilitate speedy productivity and feature convenient handling. These single component systems require no mixing and are designed to cure rapidly at moderate temperatures. Their short cure cycle results in energy and cost savings. Available for use in a variety of viscosities, these compounds are easy to apply and offer excellent bond strength. Additionally, they have superior resistance to adverse environmental conditions.
Types of Snap Cure Adhesives
- Electrically conductive
- Thermally conductive
- Electrically insulative
Most Popular Snap Cure Adhesives
- One part epoxy. Cures in 2-3 minutes at 250-300°F. Service operating temperature range of -60°F to +400°F. Ideal for bonding dissimilar substrates and for use in applications subject to thermal cycling.
- Supreme 10HTF
- Heat curing, one component, toughened epoxy adhesive/sealant. High shear and peel strength properties. Serviceable from 4K to +400°F. Resists impact, vibration and stress fatigue cracking.
- Supreme 10HTFS
- One part, no mix, silver conductive epoxy adhesive. Resistant to water and many chemicals. Serviceable from 4K to +400°F. High peel and shear strength properties. Low volume resistivity. Withstands severe thermal cycling.
- Supreme 10HTFN
- Single component, high performance snap cure adhesive. Superior electrical conductivity. Nickel filled system. Non-drip, non-sagging compound. Solvent free. Exceptional peel and shear strength properties.