Two Component, Room Temperature Curing Epoxy System for High Performance Potting, Casting, Bonding and Sealing Featuring Exceptionally Low Viscosity and Good Flexibility.
Two Component, Room Temperature Curing, Flexibilized, Thermally Conductive, Electrically Isolating Epoxy for Potting, Bonding, Sealing and Coating. Featuring Low Viscosity and Cryogenic Service Capability.
Two Component, Epoxy with Extra Low Thermal Expansion Coefficient and Unmatched Dimensional Stability For High Performance Bonding, Sealing, Coating and Casting
Two Component, Room Temperature Curing Epoxy Adhesive for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Dimensional Stability and Machinability along with Superior Chemical Resistance.
Two Component, Lower Viscosity Room Temperature Curing Epoxy Adhesive for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Dimensional Stability and Machinability along with Superior Chemical Resistance.
Two Component, Paste Consistency Room Temperature Curing Epoxy Adhesive for Bonding, Sealing and Coating Featuring High Temperature Resistance, Outstanding Dimensional Stability and Machinability along with Superior Chemical Resistance.
