Versatile Lower Viscosity, Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation; Features Superior Optical Clarity; Cryogenically Serviceable. Meets NASA Low Outgassing Specifications.
Two Component, Room Temperature Curing Epoxy for Potting, Bonding, Sealing and Coating with Unsurpassed Thermal Conductivity and Superb Electrical Insulation; Features Low Viscosity and Excellent Thermal Transfer Properties.
Two Component, Room Temperature Curing, Low Viscosity Epoxy for Potting, Sealing, Coating and Bonding Featuring Exceptionally High Thermally Conductivity and Excellent Electrical Insulation Properties. Now NASA Approved for Low Outgassing Applications
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy for Potting, Bonding, Sealing & Coating. Features Low Viscosity & Excellent Thermal Transfer Properties.
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy for Bonding, Potting, Sealing & Coating. Offers High Temperature Resistance & Excellent Thermal Properties along with Good Flow.
Two Component, Nickel Modified Room Temperature Curing Polymer System Featuring High Electrical Conductivity, Superior Bonding Strength and Chemical Resistance For EMI/RFI Shielding As Well As Bonding, Sealing and Encapsulation Applications.
Two Component, Room Temperature Curing, Transparent, Highly Flexible, Abrasion Resistant Elastomer System For High Performance Bonding, Sealing, Casting and Encapsulation Applications. Serviceable at Cryogenic Temperatures
Flexibilized, Two Component, Room Temperature Curing, Urethane-Modified Epoxy System Featuring Superior Toughness, and Abrasion Resistance for High Performance Bonding, Sealing, Coating and Encapsulation
