High Performance Low Viscosity, Flexible Optically Clear Epoxy System for Large Castings, Sealing & Bonding Featuring Exceptionally Long Working Life and Low Exotherm During Cure.
Two Component, Low Viscosity Epoxy Adhesive/Sealant For High Performance Bonding Featuring Excellent Electrical Insulation Characteristics, High Thermal Stability and Superior Chemical Resistance.
Two Component, Low Viscosity, Room Temperature Curing Epoxy Resin System For High Performance Potting, Encapsulation, Sealing and Bonding Featuring Outstanding Resistance to Thermal Shock and Mechanical Vibration, Serviceable up to 450°F
One Component, Thermal Shock and Heat Resistant, Flexibilized Epoxy System for Bonding, as well as for Potting and Encapsulations up to ¼ Inch Thick; Features Good Toughness and Fast Cures.
