Epoxies Designed To Withstand Low Temperatures
Master Bond has been at the forefront in the development and formulation of specialty epoxy systems for low temperature applications. These versatile high performance compounds are designed for bonding, sealing, potting and encapsulation usage. Available in one and two component systems, they can withstand exposure to cryogenic environments. Our products are used in critical applications such as superconducting magnets, cryogenic piping, vessels and tanks and honeycomb sandwich structures. These materials are successfully employed in the electronic, military, optical, instrumentation, medical, pharmaceutical and aerospace industries.
Our line of cryogenic epoxies includes electrically conductive systems, thermally conductive/electrically insulative systems and NASA low outgassing approved products. These high strength compounds offer long-term durability and superb chemical resistance. Master Bond EP29LPSP is a clear, low viscosity epoxy noted for its capability of withstanding severe cryogenic shocks. Also of particular interest is Master Bond EP37-3FLF. This two component room temperature curing system has excellent optical transmission properties and is designed to withstand severe thermal cycling.